Kinetics of reactive diffusion between Au and Sn during annealing at solid-state temperatures

Interdiffusion and reaction in bimetallic Cu-Sn thin films

K. N. Tu · Acta Metallurgica · 1973 · 482 citations

Materials Engineering, Materials Science, Engineering +4

Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

D. R. Frear, Paul T. Vianco · Metallurgical and Materials Transactions A · 1994 · 274 citations

Materials Science, Materials Engineering, Engineering +10

Reaction-Diffusion in the Cu–Sn System

Masami Onishi, Hideo Fujibuchi · Transactions of the Japan Institute of Metals · 1975 · 234 citations · Full text

Chemical Thermodynamics, ε Phases, Engineering +14

Diffusion in the nickel-rich part of the Ni−Al system at 1000° to 1300°C; Ni3Al layer growth, diffusion coefficients, and interface concentrations

M. M. P. Janssen · Metallurgical Transactions · 1973 · 216 citations

Materials Science, Engineering, Diffusion Resistance +6

Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging

S. Choi, Thomas R. Bieler, J. P. Lucas et al. · Journal of Electronic Materials · 1999 · 215 citations

Materials Science, Materials Engineering, Sn-pb Eutectic Solders +10