Diffusion During Annealing

Diffusion During Annealing is a thin film diffusion phenomenon characterized by the thermally activated migration of atoms or defects within a thin film structure during a post-deposition heat treatment process, distinguished from other diffusion mechanisms by its dependence on annealing-induced thermal energy and time-dependent kinetics.

453

Publications

17K

Citations

1.6K

Authors

452

Institutions

Publications per year

2017–2026

21

Authors

1.6K

  1. SS
    S. Solmi

    Institute for Microelectronics and Microsystems, Italy

    9 publications · 586 citations

    9

    h-index

  2. MK
    Masanori Kajihara

    Tokyo Institute of Technology, Japan

    9 publications · 384 citations

    9

    h-index

  3. MU
    Masashi Uematsu

    NTT Basic Research Laboratories, Japan

    9 publications · 214 citations

    9

    h-index

  4. KS
    K. S. Jones

    University of Florida, United States

    5 publications · 306 citations

    5

    h-index

  5. JP
    J.D. Plummer

    Stanford University, United States

    5 publications · 234 citations

    5

    h-index

1–5 of 1.6K

Venues

  1. Applied Physics Letters

    97 publications · 4.5K citations

    40

    h-index

  2. Journal of Applied Physics

    99 publications · 3.6K citations

    35

    h-index

  3. Journal of The Electrochemical Society

    JES · 27 publications · 1.2K citations

    19

    h-index

  4. Japanese Journal of Applied Physics

    JJAP · 24 publications · 452 citations

    13

    h-index

  5. Physical review. B, Condensed matter

    PRB · 12 publications · 467 citations

    12

    h-index

1–5