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Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging

Materials ScienceMaterials EngineeringSn-pb Eutectic SoldersEngineeringCorrosionApplied PhysicsComposite SoldersMetallurgical InteractionMaterial PerformanceElectronic PackagingIntermetallic Interfacial LayersMicrostructureCladding (Metalworking)