Concepedia

Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging

S. Choi, Thomas R. Bieler, J. P. Lucas, K. N. Subramanian

Journal of Electronic Materials · 1999 · 215 citations · 12 references

DOI

Concepts

References

12

Interdiffusion and reaction in bimetallic Cu-Sn thin films

K. N. Tu · Acta Metallurgica · 1973 · 485 citations

, , +10

Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

D. R. Frear, Paul T. Vianco · Metallurgical and Materials Transactions A · 1994 · 275 citations

, , +16

Microstructure evolution of eutectic Sn-Ag solder joints

Wenge Yang, Robert W. Messler, L.E. Felton · Journal of Electronic Materials · 1994 · 272 citations

, , +14

The growth of Cu-Sn intermetallics at a pretinned copper-solder interface

A.J. Sunwoo, J. W. Morris, George K. Lucey · Metallurgical Transactions A · 1992 · 176 citations

, , +12

The formation and growth of intermetallics in composite solder

Yujing Wu, Jennifer A. Sees, Cyrus Pouraghabagher et al. · Journal of Electronic Materials · 1993 · 141 citations

, , +11