Statistics
Publications
3
Citations
180
H-Index
3
Active since
2000
Affiliations
Gunter Engelmann is an author at Fraunhofer Institute for Reliability and Microintegration specializing in semiconductor devices, engineering, and materials science.
Publications per year
2000–2008
3
3
High aspect ratio TSV copper filling with different seed layers
M. J. Wolf, Thomas Dretschkow, Bernhard Wunderle et al. · 2008 · 109 citations
Flip chip bumping technology—Status and update
M. Juergen Wolf, Gunter Engelmann, Lothar Dietrich et al. · Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment · 2006 · 52 citations
Engineering, Computer Engineering, Electrical Engineering +14
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