Publication | Closed Access
Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking
15
Citations
15
References
2019
Year
Materials EngineeringMaterials Science3D Ic ArchitectureIsothermal StorageEngineeringWafer Scale ProcessingAdvanced Packaging (Semiconductors)MicrofabricationApplied PhysicsGrain StructureChip AttachmentElectronic PackagingMicroelectronicsMicrostructureCu/sn/cu Microbump Interconnects
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