G. Engelmann - Concepedia

Author

G. Engelmann

Fraunhofer Institute for Reliability and Microintegration

Also Known As

G ENGELMANN, G Engelmann, G. Engelmann, Gregor Engelmann

Publications

338

Citations

H-Index

Concepts

All Affiliations

Fraunhofer Institute for Reliability and Microintegration Technische Universität Berlin Fraunhofer-Gesellschaft

About

G. Engelmann is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	10	11	268
2	Applied Physics	9	9	208
3	Materials Engineering	3	3	73
4	Electrical Engineering	2	2	30
5	Chemical Engineering	1	1	10

G. Engelmann

Publications

278

Citations

H-Index

Page 1

	Year	Citations
Fabrication of high depth-to-width aspect ratio microstructures G. Engelmann, O. Ehrmann, J. Simon, EngineeringElectron-beam LithographyMechanical EngineeringThin Film Process TechnologyMicro-optical Component	1992	55
Microactuators with moving magnets for linear, torsional or multiaxial motion B. Wagner, W. Benecke, G. Engelmann, Sensors and Actuators A Physical Multiaxial MotionEngineeringMicrofabricationMechanicsMechanical Engineering	1992	40
Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumps Matthias Hütter, F. Hohnke, Hermann Oppermann, Au/sn BumpsEngineeringMechanical EngineeringWafer Scale ProcessingAdvanced Packaging (Semiconductors)	2004	32
Magnetically driven microstructures fabricated with multilayer electroplating Bernd Löchel, Hans-Joachim Quenzer, B. Wagner, Sensors and Actuators A Physical Materials ScienceMagnetismEngineeringMicrofabricationApplied Physics	1995	31
Fluxless flip chip assembly on rigid and flexible polymer substrates using the Au-Sn metallurgy E. Zakel, J. Gwiasda, J. Kloeser, EngineeringMechanical EngineeringFlip ChipAdvanced Packaging (Semiconductors)Electronic Packaging	1994	21
Precise flip chip assembly using electroplated AuSn20 and SnAg3.5 solder Matthias Hütter, Hermann Oppermann, G. Engelmann, EngineeringOptoelectronic DevicesFlip ChipAdvanced Packaging (Semiconductors)Snag3.5 Solder	2006	20
Calculation of shape and experimental creation of AuSn solder bumps for flip chip applications Matthias Hütter, Hermann Oppermann, G. Engelmann, EngineeringMechanical EngineeringEutectic Solder CapAusn Solder BumpsAdvanced Packaging (Semiconductors)	2002	20
High depth to width aspect ratios in thick positive photoresist layers using near UV lithography G. Engelmann, H. Reichl Microelectronic Engineering High DepthEngineeringElectron-beam LithographyBeam LithographyOptical Properties	1992	19
Development and fabrication of a thin film thermo test chip and its integration into a test system for thermal interface characterization Mohamad AboRas, G. Engelmann, D. May,	2013	10
Selectively released microstructures electroplated into thick positive photoresist G. Engelmann, O. Ehrmann, R. Leutenbauer, Journal of Micromechanics and Microengineering Materials ScienceElectroactive MaterialArbitrary ShapeEngineeringBeam Lithography	1993	10

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