G. Engelmann

Fabrication of high depth-to-width aspect ratio microstructures

G. Engelmann, O. Ehrmann, J. Simon et al. · 1992 · 55 citations

Engineering, Electron-beam Lithography, Mechanical Engineering +20

Microactuators with moving magnets for linear, torsional or multiaxial motion

B. Wagner, W. Benecke, G. Engelmann et al. · Sensors and Actuators A Physical · 1992 · 40 citations

Multiaxial Motion, Engineering, Microfabrication +11

Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumps

Matthias Hütter, F. Hohnke, Hermann Oppermann et al. · 2004 · 32 citations

Au/sn Bumps, Engineering, Mechanical Engineering +16

Magnetically driven microstructures fabricated with multilayer electroplating

Bernd Löchel, Hans-Joachim Quenzer, B. Wagner et al. · Sensors and Actuators A Physical · 1995 · 31 citations

Materials Science, Magnetism, Engineering +6

Fluxless flip chip assembly on rigid and flexible polymer substrates using the Au-Sn metallurgy

E. Zakel, J. Gwiasda, J. Kloeser et al. · 1994 · 21 citations

Engineering, Mechanical Engineering, Flip Chip +21