Concepedia

J. Simon

JS

11

Publications

313

Citations

10

H-Index

1987

Active since

Affiliations

Technische Universität Berlin(Current)

J. Simon is an author at Technische Universität Berlin specializing in engineering, electronic packaging, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringMechanical EngineeringMaterial ScienceMicroelectronicsMicrofabricationMaterials EngineeringSurface ScienceCorrosion

Publications per year

1987–2002

11

Publications

11

Fabrication of high depth-to-width aspect ratio microstructures

G. Engelmann, O. Ehrmann, J. Simon et al. · 1992 · 55 citations

Engineering, Electron-beam Lithography, Mechanical Engineering +20

Electroless deposition of bumps for TAB technology

J. Simon, E. Zakel, H. Reichl · 2002 · 46 citations

Engineering, Chemical Deposition, Printed Electronics +17

Microactuators with moving magnets for linear, torsional or multiaxial motion

B. Wagner, W. Benecke, G. Engelmann et al. · Sensors and Actuators A Physical · 1992 · 40 citations

Multiaxial Motion, Engineering, Microfabrication +11

The pretreatment of aluminum bondpads for electroless nickel bumping

Andreas Ostmann, J. Simon, H. Reichl · 2002 · 38 citations

Engineering, Mechanical Engineering, Anodizing +16

Electroless nickel/copper plating as a new bump metallization

R. Aschenbrenner, Andreas Ostmann, U. Beutler et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1995 · 29 citations

Engineering, Mechanical Engineering, New Bump Metallization +18

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