Statistics
Publications
66
Citations
1.8K
H-Index
24
Active since
1995
R. Aschenbrenner is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, chip packaging, and microfabrication.
Publications per year
1995–2022
66
66
Large area compression molding for Fan-out Panel Level Packing
Tanja Braun, S. Raatz, S. Voges et al. · 2015 · 77 citations
Engineering, Manufacturing Engineering, Manufacturing Processes +11
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