Publication | Open Access
Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric
133
Citations
3
References
2005
Year
Unknown Venue
Smart TextileEngineeringWearable TechnologyE-textilesSoft RoboticsElectrical InterconnectsStretchable ElectronicsMaterials ScienceElectrical ContactElectrical EngineeringFlexible Electronic ModulesTextile StructureWearable ElectronicsConductive Yarn3D PrintingTextile FibreCommon EmbroideryIndustrial DesignFlexible ElectronicsMicrofabricationTechnologyMold Encapsulation
This paper shows how common embroidery can be used to integrate electronics into textile environment in a light and cost efficient way. A mechanism has been developed to embroider through flexible electronic modules using conductive yarn, thus creating an interconnection with other modules like sensors, batteries, textile keyboards, etc. Mold encapsulation has been found to improve the electrical contact and support the reliability of the whole system.
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