2003 · 45 citations · 2 references
EngineeringElectrical EngineeringMaterials ScienceAntennasElectronic MaterialsMicrofabricationChip PackagingFabrication MaterialsMicrofabrication MaterialsSmart TextilesTechnical TextilesTextile MaterialsFlexible SubstratesLabelsMechanical Load EffectsSilicon Thin FilmsSmart LabelsTextile SensorsWashable ElectronicsWashing
S.1123-1126
2
Innovative packaging concepts for ultra thin integrated circuits
G. Klink, Michael Feil, Frank Ansorge et al. · 2001 · 20 citations