Michael Feil

Statistics

Publications

Citations

214

H-Index

Active since

1981

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Fraunhofer-Gesellschaft

Michael Feil is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, microfabrication, and wafer bonding.

Publications per year

1981–2020

Publications

The challenge of ultra thin chip assembly

Michael Feil, C. L. Adler, Dieter Hemmetzberger et al. · 2004 · 56 citations

Engineering, Manufacturing Engineering, Materials Science +14

Low-cost microphysiological systems: feasibility study of a tape-based barrier-on-chip for small intestine modeling

Thomas E. Winkler, Michael Feil, Eva F.G.J. Stronkman et al. · Lab on a Chip · 2020 · 52 citations · Full text

Engineering, Bioengineering, Biomedical Engineering +15

Embedding and assembly of ultrathin chips in multilayer flex boards

Wim Christiaens, T. Loeher, Barbara Pahl et al. · Circuit World · 2008 · 31 citations

Engineering, Materials Engineering, Materials Science +12

Ultra thin ICs and MEMS elements: techniques for wafer thinning, stress-free separation, assembly and interconnection

Michael Feil, C.J. Alder, G. Klink et al. · Microsystem Technologies · 2003 · 21 citations

Engineering, Computer Engineering, Electrical Engineering +17

Innovative packaging concepts for ultra thin integrated circuits

G. Klink, Michael Feil, Frank Ansorge et al. · 2001 · 20 citations

Engineering, Electrical Engineering, Microelectronics +15

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