T. Loeher

Publications

228

Citations

H-Index

2005

Active since

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Imec the Netherlands

Dalian University of Technology

IMEC

T. Loeher is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringMaterial ScienceElectronic PackagingChemistry3D PrintingMicroelectronicsMicrofabricationComputer EngineeringMaterials EngineeringElectrical Engineering

Publications per year

2005–2012

Publications

Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders

Mingliang Huang, T. Loeher, Andreas Ostmann et al. · Applied Physics Letters · 2005 · 91 citations

Materials Science, Materials Engineering, Engineering +14

Reliability issues in Pb-free solder joint miniaturization

Zhiheng Huang, Paul Conway, Erik Jung et al. · Journal of Electronic Materials · 2006 · 42 citations

Reliability Issues, Reliability Engineering, Engineering +4

Embedding and assembly of ultrathin chips in multilayer flex boards

Wim Christiaens, T. Loeher, Barbara Pahl et al. · Circuit World · 2008 · 31 citations

SCB and SMI: two stretchable circuit technologies, based on standard printed circuit board processes

Jan Vanfleteren, T. Loeher, Mario González et al. · Circuit World · 2012 · 29 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +25

Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders

Mingliang Huang, T. Loeher, Dionysios Manessis et al. · Journal of Electronic Materials · 2006 · 25 citations

Materials Science, Materials Engineering, Intermetallic Compounds +7

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