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Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders

Materials ScienceMaterials EngineeringIntermetallic CompoundsEngineeringSurface ElectrochemistryChemistryGrowth KineticsSn-based Lead-free SoldersElectrochemistryElectrochemical Surface Science