Lars Boettcher

Innovative and Reliable Power Modules: A Future Trend and Evolution of Technologies

Christoph Neeb, Lars Boettcher, Marcus Conrad et al. · IEEE Industrial Electronics Magazine · 2014 · 95 citations

Engineering, Electrical Engineering, Materials Engineering +17

Embedding of Chips for System in Package realization - Technology and Applications

Lars Boettcher, Dionysios Manessis, Andreas Ostmann et al. · 2008 · 45 citations

Engineering, Electrical Engineering, Manufacturing Engineering +13

Panel Level Packaging - A View Along the Process Chain

Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck et al. · 2018 · 40 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +13

Chip embedding technology developments leading to the emergence of miniaturized system-in-packages

Dionysios Manessis, Lars Boettcher, Andreas Ostmann et al. · 2010 · 33 citations

Engineering, Electrical Engineering, Materials Engineering +15

Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders

Mingliang Huang, T. Loeher, Dionysios Manessis et al. · Journal of Electronic Materials · 2006 · 25 citations

Natural Sciences, Materials Engineering, Materials Science +17