Dionysios Manessis

Publications

553

Citations

H-Index

2002

Active since

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Foundation for Research and Technology Hellas

University of Ioannina

Aristotle University of Thessaloniki

Dionysios Manessis is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, electronic packaging, and microelectronics.

ORCID

Top concepts

EngineeringElectronic PackagingMicroelectronicsComputer EngineeringElectrical EngineeringMicrofabricationMaterial ScienceMechanical Engineering3D PrintingMicrostructure

Publications per year

2002–2023

Publications

Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping

Dionysios Manessis, R. Patzelt, Andreas Ostmann et al. · Microelectronics Reliability · 2003 · 63 citations

Engineering, Stencil Printing Technology, Microfabrication +9

Embedding of Chips for System in Package realization - Technology and Applications

Lars Boettcher, Dionysios Manessis, Andreas Ostmann et al. · 2008 · 44 citations

Engineering, Package Realization, Computer Architecture +19

Multifunctional Metasurface Architecture for Amplitude, Polarization and Wave-Front Control

Alexandros Pitilakis, Manuel Seckel, Anna C. Tasolamprou et al. · Physical Review Applied · 2022 · 41 citations · Full text

Toward the Realization of a Programmable Metasurface Absorber Enabled by Custom Integrated Circuit Technology

Kypros M. Kossifos, Loukas Petrou, Giorgos Varnava et al. · IEEE Access · 2020 · 40 citations · Full text

Engineering, Negative-index Metamaterial, Smart Surface +16

Effects of Co addition in eutectic Sn–3.5Ag solder on shear strength and microstructural development

Kunmo Chu, R. Patzelt, Dionysios Manessis et al. · Microelectronic Engineering · 2008 · 38 citations

Materials Science, Engineering, Powder Metallurgy +7

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