Andreas Ostmann

Statistics

Publications

Citations

1.5K

H-Index

Active since

1992

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Korea Advanced Institute of Science and Technology

Fraunhofer-Gesellschaft

Andreas Ostmann is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, materials engineering, and materials science.

Publications per year

1992–2022

Publications

Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders

Mingliang Huang, T. Loeher, Andreas Ostmann et al. · Applied Physics Letters · 2005 · 91 citations

Engineering, Materials Engineering, Materials Science +17

A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy

Young-Doo Jeon, Sabine Nieland, Andreas Ostmann et al. · Journal of Electronic Materials · 2003 · 70 citations

Natural Sciences, Materials Engineering, Materials Science +11

Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping

Dionysios Manessis, R. Patzelt, Andreas Ostmann et al. · Microelectronics Reliability · 2003 · 63 citations

Engineering, Manufacturing Engineering, Materials Engineering +6

Packaging Very Fast Switching Semiconductors

Eckart Hoene, Andreas Ostmann, Christoph Marczok · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 2014 · 60 citations

Engineering, Electrical Engineering, Materials Science +12

3D System Integration Technologies

Peter Ramm, Armin Klumpp, R. Merkel et al. · MRS Proceedings · 2003 · 55 citations

Engineering, Computer Engineering, Electrical Engineering +17

1–5 of 53