Young-Doo Jeon - Concepedia

Author

Young-Doo Jeon

Korea Advanced Institute of Science and Technology

Also Known As

Young-Doo Jeon

Publications

426

Citations

H-Index

Concepts

All Affiliations

Korea Advanced Institute of Science and Technology Fraunhofer Institute for Reliability and Microintegration Hanwha Techwin (South Korea)

About

Young-Doo Jeon is an author at Korea Advanced Institute of Science and Technology specializing in engineering, electronic packaging, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	12	12	392
2	Applied Physics	8	8	245
3	Chemistry	2	2	67
4	Natural Sciences	1	1	22
5	Chemical Engineering	1	1	45

Young-Doo Jeon

Publications

402

Citations

H-Index

Page 1

	Year	Citations
A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy Young-Doo Jeon, Sabine Nieland, Andreas Ostmann, Journal of Electronic Materials Materials ScienceMaterials EngineeringInterfacial ReactionsElectroless Ni-pEngineering	2003	70
Studies of electroless nickel under bump metallurgy—Solder interfacial reactions and their effects on flip chip solder joint reliability Young-Doo Jeon, Kyung‐Wook Paik, Kyung-Soon Bok, Journal of Electronic Materials Materials ScienceEngineeringCorrosionMechanical EngineeringElectroless Nickel	2002	45
Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless nickel UBM-solder interface and their effects on flip chip solder joint reliability Young-Doo Jeon, Kyung‐Wook Paik, Kyoung-Soon Bok, EngineeringElectrode-electrolyte InterfaceChemistryChemical EngineeringAdvanced Packaging (Semiconductors)	2002	45
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages Se Young Yang, Young-Doo Jeon, Soon-Bok Lee, Microelectronics Reliability ReliabilityElectrical EngineeringReliability EngineeringEngineeringChip-scale Package	2005	41
Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy Young-Doo Jeon, Kyung‐Wook Paik, A. Ostmann, Journal of Electronic Materials Materials ScienceMaterials EngineeringElectrical EngineeringEngineeringPowder Metallurgy	2005	39
Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications Myung-Jin Yim, Woonghwan Ryu, Young-Doo Jeon, IEEE Transactions on Components and Packaging Technologies Electrical EngineeringEngineeringAdvanced Packaging (Semiconductors)High-frequency DeviceHigh Frequency Applications	1999	37
Reduced thermal strain in flip chip assembly on organic substrate using low CTE anisotropic conductive film Myung Jin Yim, Young-Doo Jeon, Kyung‐Wook Paik IEEE Transactions on Electronics Packaging Manufacturing EngineeringOrganic ElectronicsMechanical EngineeringFlip ChipAcf Materials	2000	34
Comparison of interfacial reactions and reliabilifies of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electroless Ni-P UBMs Young-Doo Jeon, Andreas Ostmann, H. Reichl, Interfacial ReactionsEngineeringMechanical EngineeringChemistrySolder Bump	2003	22
Interfacial reactions and bump reliability of various Pb-free solder bumps on electroless Ni-P UBMs Kyung‐Wook Paik, Young-Doo Jeon, Moon-Gi Cho Sncu SoldersInterfacial ReactionsEngineeringBump ReliabilityAdvanced Packaging (Semiconductors)	2004	16
Thin Electroless Cu/OSP on Electroless Ni as a Novel Surface Finish for Flip-Chip Solder Joints Young-Doo Jeon, Yongbin Lee, Young-Sik Choi EngineeringFlip-chip Solder JointsMechanical EngineeringSurface ProcessingGood Reliability	2006	16

Page 1