Young-Doo Jeon

Statistics

Publications

Citations

403

H-Index

Active since

1999

Affiliations

Korea Advanced Institute of Science and Technology(Current)

Fraunhofer Institute for Reliability and Microintegration

Hanwha Techwin (South Korea)

Young-Doo Jeon is an author at Korea Advanced Institute of Science and Technology specializing in materials science, electronic materials, and materials engineering.

Publications per year

1999–2006

Publications

A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy

Young-Doo Jeon, Sabine Nieland, Andreas Ostmann et al. · Journal of Electronic Materials · 2003 · 70 citations

Natural Sciences, Materials Engineering, Materials Science +11

Studies of electroless nickel under bump metallurgy—Solder interfacial reactions and their effects on flip chip solder joint reliability

Young-Doo Jeon, Kyung‐Wook Paik, Kyung-Soon Bok et al. · Journal of Electronic Materials · 2002 · 45 citations

Natural Sciences, Materials Engineering, Materials Science +12

Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless nickel UBM-solder interface and their effects on flip chip solder joint reliability

Young-Doo Jeon, Kyung‐Wook Paik, Kyoung-Soon Bok et al. · 2002 · 45 citations

Engineering, Materials Engineering, Materials Science +17

Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages

Se Young Yang, Young-Doo Jeon, Soon-Bok Lee et al. · Microelectronics Reliability · 2005 · 41 citations

Engineering, Materials Engineering, Materials Science +14

Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy

Young-Doo Jeon, Kyung‐Wook Paik, A. Ostmann et al. · Journal of Electronic Materials · 2005 · 40 citations

Natural Sciences, Materials Engineering, Materials Science +17

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