Concepedia

Studies of electroless nickel under bump metallurgy—Solder interfacial reactions and their effects on flip chip solder joint reliability

Young-Doo Jeon, Kyung‐Wook Paik, Kyung-Soon Bok, Woo-Suk Choi, Chul-Lae Cho

Journal of Electronic Materials · 2002 · 45 citations · 6 references

DOI

Concepts

References

6

Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

Jihun Jang, P. G. Kim, K. N. Tu et al. · Journal of Applied Physics · 1999 · 283 citations

, , +17

Growth kinetics of intermetallic phases at the liquid Sn and solid Ni interface

S. K. Kang, V. Ramachandran · Scripta Metallurgica · 1980 · 127 citations

, , +17

Reactive isothermal solidification in the Ni–Sn system

David Gur · Acta Materialia · 1998 · 112 citations

, , +14

The interaction kinetics and compound formation between electroless NiP and solder

Chwan-Ying Lee Chwan-Ying Lee, Kwang‐Lung Lin · Thin Solid Films · 1994 · 98 citations

, , +11

Kinetics of intermetallic compound growth between nickel, electroless, Ni-P, electroless Ni-B and tin at 453 to 493 K

W. J. Tomlinson, H. G. Rhodes · Journal of Materials Science · 1987 · 65 citations

, , +14