Concepedia

Author

A. Ostmann

Fraunhofer Institute for Reliability and Microintegration

Also Known As

A. Ostmann, Adreas Ostmann

11

Publications

62

Citations

3

H-Index

13

Concepts

All Affiliations

Fraunhofer Institute for Reliability and Microintegration
AO

About

A. Ostmann is an author at Fraunhofer Institute for Reliability and Microintegration specializing in electrical engineering, materials science, and materials engineering.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

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Electrical Engineering

2

2

49

3

Materials Engineering

2

2

49

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Materials Science

2

2

49

5

Applied Physics

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10

A. Ostmann

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2

Publications

49

Citations

2

H-Index

YearCitations

Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy

Young-Doo Jeon, Kyung‐Wook Paik, A. Ostmann,

Journal of Electronic Materials

2005

39

Reliability of Electroless Nickel for High Temperature Applications

S. Anhoeck, A. Ostmann, Hermann Oppermann,

International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces

1999

10

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