Concepedia

A. Ostmann

AO

Statistics

Publications

2

Citations

50

H-Index

2

Active since

1999

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

A. Ostmann is an author at Fraunhofer Institute for Reliability and Microintegration specializing in electronic materials, metallurgy, and metals.

Publications per year

1999–2005

2

Publications

2

Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy

Young-Doo Jeon, Kyung‐Wook Paik, A. Ostmann et al. · Journal of Electronic Materials · 2005 · 40 citations

, , +17

Reliability of Electroless Nickel for High Temperature Applications

S. Anhoeck, A. Ostmann, Hermann Oppermann et al. · International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces · 1999 · 10 citations

, , +15

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