Ole Hoelck

Statistics

Publications

Citations

150

H-Index

Active since

2018

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Ole Hoelck is an author at Fraunhofer Institute for Reliability and Microintegration specializing in fan-out wafer-level packaging, engineering, and packaging engineering.

Publications per year

2018–2022

Publications

Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration

Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck et al. · Micromachines · 2019 · 51 citations · Full text

Engineering, Manufacturing Engineering, Energy Systems +14

Panel Level Packaging - A View Along the Process Chain

Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck et al. · 2018 · 40 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +13

Fan-out wafer level packaging for 5G and mm-Wave applications

Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck et al. · 2018 · 23 citations

Engineering, Electrical Engineering, Antennas +16

Fan-Out Wafer Level Packaging - A Platform for Advanced Sensor Packaging

Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck et al. · 2019 · 22 citations

Engineering, Biomedical Engineering, Materials Science +17

Low‐Temperature Processible Highly Conducting Pastes for Printed Electronics Applications

Vitalij Scenev, Jerzy Szałapak, Lukas Werft et al. · Advanced Engineering Materials · 2022 · 14 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +6

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