Reliability issues in Pb-free solder joint miniaturization - Concepedia

Concepedia

Publication | Closed Access

Reliability issues in Pb-free solder joint miniaturization

42

Citations

28

References

2006

Year

Zhiheng Huang, Paul Conway, Erik Jung, R.C. Thomson, Changqing Liu, T. Loeher, Mathias Minkus

Journal of Electronic Materials

Reliability IssuesReliability EngineeringEngineeringHardware ReliabilityAdvanced Packaging (Semiconductors)Chip AttachmentElectronic Packaging

References

	Year	Citations

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