Erik Jung

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Publications

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Active since

1995

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

University of Bologna

Fraunhofer-Gesellschaft

Pohang University of Science and Technology

Erik Jung is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, microelectronics, and electronic packaging.

ORCID

Top concepts

EngineeringMicroelectronicsElectronic PackagingMicrofabricationElectrical EngineeringComputer EngineeringMaterial Science3D PrintingMechanical EngineeringBiomedical Engineering

Publications per year

1995–2023

Publications

Ultrasound experiments on acoustical activity in chiral mechanical metamaterials

Tobias Frenzel, Julian Köpfler, Erik Jung et al. · Nature Communications · 2019 · 120 citations · Full text

Packaging of bio-MEMS: strategies, technologies, and applications

Thomas Velten, H.H. Ruf, David A. Barrow et al. · IEEE Transactions on Advanced Packaging · 2005 · 99 citations

Engineering, Biocompatibility, Biofabrication +20

3-D Capacitive Interconnections With Mono- and Bi-Directional Capabilities

A. Fazzi, R. Canegallo, Luca Ciccarelli et al. · IEEE Journal of Solid-State Circuits · 2008 · 86 citations

Wireless Communications, Engineering, Communication Circuit +17

Reliability assessment of flip-chip assemblies with lead-free solder joints

Andreas Schubert, R. Dudek, H. Walter et al. · 2002 · 75 citations

Electrical Resistance, Engineering, Reliability Assessment +19

On-chip automation of cell-free protein synthesis: new opportunities due to a novel reaction mode

Victoria Georgi, Martin Blechert, M. Bergmeister et al. · Lab on a Chip · 2015 · 50 citations · Full text

Engineering, Molecular Biology, Synthetic Circuit +23

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