Concepedia

Barbara Pahl

BP

6

Publications

129

Citations

6

H-Index

2003

Active since

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Delft University of Technology

Barbara Pahl is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, electronic packaging, and flexible electronics.

Top concepts

Publications per year

2003–2022

6

Publications

6

Carbon nanotubes for nanoscale low temperature flip chip connections

Sascha Hermann, Barbara Pahl, Ramona Ecke et al. · Microelectronic Engineering · 2009 · 38 citations

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Embedding and assembly of ultrathin chips in multilayer flex boards

Wim Christiaens, T. Loeher, Barbara Pahl et al. · Circuit World · 2008 · 31 citations

Long time reliability study of soldered flip chips on flexible substrates

Barbara Pahl, Christine Kallmayer, R. Aschenbrenner et al. · Microelectronics Reliability · 2003 · 20 citations

, , +10

Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation

Anna Pak, Kambiz Nanbakhsh, O. Hölck et al. · Micromachines · 2022 · 15 citations · Full text

Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implants

Kambiz Nanbakhsh, Marta Kluba, Barbara Pahl et al. · 2019 · 13 citations

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