O. Hölck - Concepedia

Author

O. Hölck

Fraunhofer Institute for Reliability and Microintegration ORCID

Also Known As

Hölck, Ole, Iuliana Panchenko, O. Holck, O. Hölck, Ole Holck, Ole Hölck

Publications

740

Citations

H-Index

Concepts

All Affiliations

Fraunhofer Institute for Reliability and Microintegration Chemnitz University of Technology Technische Universität Berlin Fraunhofer Institute for Electronic Nano Systems Federal Institute For Materials Research and Testing

About

O. Hölck is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, materials science, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	23	532
2	Applied Physics	10	11	175
3	Chemistry	6	6	228
4	Natural Sciences	3	3	53
5	Medicine	1	1	11

O. Hölck

Publications

593

Citations

H-Index

Page 1

	Year	Citations
Gas sorption isotherms in swelling glassy polymers—Detailed atomistic simulations O. Hölck, Martin Böhning, Matthias Heuchel, Journal of Membrane Science Materials ScienceEngineeringGas Sorption IsothermsGlass TransitionPolymer Science	2012	77
CO<sub>2</sub> Sorption Induced Dilation in Polysulfone: Comparative Analysis of Experimental and Molecular Modeling Results O. Hölck, Martin Siegert, Matthias Heuchel, Macromolecules Chemical KineticsEngineeringMechanical EngineeringChemistrySoft Matter	2006	57
Atomistic packing models for experimentally investigated swelling states induced by CO<sub>2</sub> in glassy polysulfone and poly(ether sulfone) Matthias Heuchel, Martin Böhning, O. Hölck, Journal of Polymer Science Part B Polymer Physics Materials ScienceMolecular Dynamics MethodsEngineeringPolymer SciencePolymer Processing	2006	41
The crystallographic dependence of surface topographical features formed by energetic ion bombardment of copper J. L. Whitton, O. Hölck, G. Carter, Nuclear Instruments and Methods Surface CharacterizationEngineeringEnergetic Ion BombardmentPhysicsSurface Analysis	1980	37
Development of a Multi-project Fan-Out Wafer Level Packaging Platform Tanja Braun, S. Raatz, Marius van Dijk, EngineeringComputer ArchitectureMulti-layer StructureAdvanced Packaging (Semiconductors)Heterogeneous Integration	2017	32
Molecular dynamics approach to structure–property correlation in epoxy resins for thermo-mechanical lifetime modeling Bernhard Wunderle, E. Dermitzaki, O. Hölck, Microelectronics Reliability Materials ScienceEngineeringEpoxy ResinsMechanical PropertiesPolymer Science	2010	31
Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis Erick Franieck, M. Fleischmann, O. Hölck, Polymers EngineeringMechanical EngineeringGlass MaterialGlass-ceramicInline Dielectric Analysis	2021	31
Simulation of experimentally observed dilation phenomena during integral gas sorption in glassy polymers O. Hölck, Matthias Heuchel, Martin Böhning, Journal of Polymer Science Part B Polymer Physics EngineeringGlass-forming LiquidFluid MechanicsGlassy PolymersIntegral Gas Sorption	2007	29
Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination O. Hölck, J. Bauer, Olaf Wittler, Microelectronics Reliability Materials ScienceEngineeringAdvanced Packaging (Semiconductors)Flexible ElectronicsMicrofabrication	2012	22
Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling O. Hölck, E. Dermitzaki, Bernhard Wunderle, Microelectronics Reliability Materials ScienceMaterials EngineeringEngineeringMaterial SimulationApplied Physics	2011	19

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