Publication | Closed Access
Long time reliability study of soldered flip chips on flexible substrates
20
Citations
2
References
2003
Year
Soldered Flip ChipsElectrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Flexible ElectronicsMicrofabricationHardware ReliabilityChip On BoardFlexible SubstratesChip AttachmentElectronic PackagingMicroelectronics
| Year | Citations | |
|---|---|---|
Page 1
Page 1