G. Klink

An Integrated 13.56-MHz RFID Tag in a Printed Organic Complementary TFT Technology on Flexible Substrate

Vincenzo Fiore, Placido Battiato, Sahel Abdinia et al. · IEEE Transactions on Circuits and Systems I Regular Papers · 2015 · 141 citations · Full text

Engineering, Radio Frequency, Flexible Electronics +10

New dicing and thinning concept improves mechanical reliability of ultra thin silicon

Christof Landesberger, G. Klink, G. Schwinn et al. · 2001 · 63 citations

Engineering, Mechanical Engineering, Thin Silicon Samples +20

Microfluidics on foil: State of the art and new developments

Thomas Velten, H. Schuck, Martin Richter et al. · Proceedings of the Institution of Mechanical Engineers Part B Journal of Engineering Manufacture · 2008 · 35 citations

Engineering, Flexible Electronics, Microfabrication +12

Ultra thin ICs and MEMS elements: techniques for wafer thinning, stress-free separation, assembly and interconnection

Michael Feil, C.J. Alder, G. Klink et al. · Microsystem Technologies · 2003 · 21 citations

Materials Science, 3D Ic Architecture, Electrical Engineering +11

Innovative packaging concepts for ultra thin integrated circuits

G. Klink, Michael Feil, Frank Ansorge et al. · 2001 · 20 citations

Advanced Packaging, 3D Ic Architecture, Electrical Engineering +15