G. Schwinn

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Active since

2001

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

G. Schwinn is an author at Fraunhofer Institute for Reliability and Microintegration specializing in microfabrication, engineering, and wafer bonding.

Publications per year

2001–2003

Publications

New dicing and thinning concept improves mechanical reliability of ultra thin silicon

Christof Landesberger, G. Klink, G. Schwinn et al. · 2001 · 64 citations

Engineering, Manufacturing Engineering, Materials Science +17

Ultra thin ICs and MEMS elements: techniques for wafer thinning, stress-free separation, assembly and interconnection

Michael Feil, C.J. Alder, G. Klink et al. · Microsystem Technologies · 2003 · 21 citations

Engineering, Computer Engineering, Electrical Engineering +17

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