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Ultra thin ICs and MEMS elements: techniques for wafer thinning, stress-free separation, assembly and interconnection
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2003
Year
Materials Science3D Ic ArchitectureElectrical EngineeringWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)MicrofabricationMems ElementsApplied PhysicsUltra Thin IcsSemiconductor Device FabricationElectronic PackagingMicroelectronicsWafer Thinning
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