M. König

Statistics

Publications

Citations

233

H-Index

Active since

1993

Affiliations

Fraunhofer Research Institution for Microsystems and Solid State Technologies(Current)

Fraunhofer-Gesellschaft

Joanneum Research

BASF (Switzerland)

Obducat (Sweden)

M. König is an author at Fraunhofer Research Institution for Microsystems and Solid State Technologies specializing in engineering, microfabrication, and materials science.

Top concepts

EngineeringMicrofabricationMaterial ScienceApplied PhysicsMicroelectronics3D PrintingElectrical EngineeringOrganic ElectronicsElectronic PackagingBiomedical Engineering

Publications per year

1993–2018

Publications

The challenge of ultra thin chip assembly

Michael Feil, C. L. Adler, Dieter Hemmetzberger et al. · 2004 · 56 citations

Materials Science, Chip-scale Package, Engineering +13

Galvanoplated 3D structures for micro systems

Bernd Löchel, M. König, Hans-Joachim Quenzer et al. · Microelectronic Engineering · 1994 · 39 citations

Materials Science, Geometric Modeling, Engineering +9

B-TREPID: Batteryless tamper-resistant envelope with a PUF and integrity detection

Vincent Immler, Johannes Obermaier, M. König et al. · 2018 · 39 citations

Hardware Security, Lightweight Authentication Mechanism, Electrical Engineering +15

Self-aligned flexible organic thin-film transistors with gates patterned by nano-imprint lithography

Herbert Gold, Anja Haase, Alexander Fian et al. · Organic Electronics · 2015 · 34 citations

Materials Science, Electrical Engineering, Nano-imprint Lithography +10

Ultra thin ICs and MEMS elements: techniques for wafer thinning, stress-free separation, assembly and interconnection

Michael Feil, C.J. Alder, G. Klink et al. · Microsystem Technologies · 2003 · 21 citations

Materials Science, 3D Ic Architecture, Electrical Engineering +11

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