Frank Ansorge

Publications

Citations

H-Index

1997

Active since

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Frank Ansorge is an author at Fraunhofer Institute for Reliability and Microintegration specializing in microfabrication, electronic packaging, and engineering.

Top concepts

EngineeringMicrofabricationElectronic PackagingMicroelectronicsMechanical Engineering3D PrintingSolid MechanicsMaterial ScienceAdvanced PackagingIntegrated Circuits

Publications per year

1997–2011

Publications

Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds

Thomas Schreier-Alt, Frank Rehme, Frank Ansorge et al. · Microelectronics Reliability · 2010 · 24 citations

Materials Science, Engineering, Microfabrication +8

Innovative packaging concepts for ultra thin integrated circuits

G. Klink, Michael Feil, Frank Ansorge et al. · 2001 · 20 citations

Advanced Packaging, 3D Ic Architecture, Electrical Engineering +15

Stress analysis during assembly and packaging

Thomas Schreier-Alt, Katrin Unterhofer, Frank Ansorge et al. · 2011 · 16 citations

Transfer Molding, Cmos Chip, Reliability Engineering +12

Damage and failure behaviour of a woven C/SiC material

L. Hahn, Frank Ansorge, A. Brückner‐Foit · Journal of Materials Science · 1997 · 13 citations

Thermo-mechanical stress analysis

Katrin Niehoff, Thomas Schreier-Alt, Florian Schindler-Saefkow et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 2009 · 11 citations

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