Florian Schindler-Saefkow

Statistics

Publications

Citations

147

H-Index

Active since

2006

Affiliations

Angewandte Micro Messtechnik (Germany)(Current)

IBM Research - Zurich

Chemnitz University of Technology

Fraunhofer Institute for Reliability and Microintegration

Fraunhofer Institute for Electronic Nano Systems

Florian Schindler-Saefkow is an author at Angewandte Micro Messtechnik (Germany) specializing in engineering, materials engineering, and materials science.

Publications per year

2006–2016

Publications

Novel Stress Measurement System for Evaluation of Package Induced Stress

Hartmut Kittel, Stefan Endler, Heinz Osterwinter et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 2008 · 36 citations

Engineering, Electrical Engineering, Mechanical Engineering +17

Stress chip measurements of the internal package stress for process characterization and health monitoring

Florian Schindler-Saefkow, Florian Rost, Alexander Otto et al. · 2012 · 26 citations

Engineering, Materials Engineering, Materials Science +17

Thermal Management in a 3D-PCB-Package with Water Cooling

Florian Schindler-Saefkow, Olaf Wittler, D. May et al. · 2006 1st Electronic Systemintegration Technology Conference · 2006 · 15 citations · Full text

Engineering, Mechanical Engineering, Heat Transfer +16

Sequentially formed underfills: Thermo-mechanical properties of underfills at full filler percolation

Gerd Schlottig, Florian Schindler-Saefkow, Jonas Zürcher et al. · 2013 · 15 citations

Engineering, Materials Engineering, Materials Science +16

Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks

Thomas Brunschwiler, Jonas Zürcher, Luca Del Carro et al. · Journal of Electronic Packaging · 2016 · 14 citations

Engineering, Materials Engineering, Materials Science +17

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