Stefan Endler

Novel Stress Measurement System for Evaluation of Package Induced Stress

Hartmut Kittel, Stefan Endler, Heinz Osterwinter et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 2008 · 36 citations

Ultra-thin chip technology for system-in-foil applications

Evangelos A. Angelopoulos, Martin Zimmermann, Wolfgang Appel et al. · 2010 · 27 citations

Two-Dimensional Flex Sensor Exploiting Stacked Ultrathin Chips

Stefan Endler, Saleh Ferwana, Horst Rempp et al. · IEEE Electron Device Letters · 2012 · 17 citations

Materials Science, Flexible Stress, Engineering +15

Compensation of externally applied mechanical stress by stacking of ultrathin chips

Stefan Endler, Horst Rempp, Christine Harendt et al. · Solid-State Electronics · 2012 · 14 citations

Materials Science, Engineering, Advanced Packaging (Semiconductors) +12

Mechanical characterisation of ultra-thin chips

Stefan Endler, Evangelos A. Angelopoulos, Horst Rempp et al. · 2011 · 13 citations

Engineering, Mechanical Engineering, Integrated Circuits +19