Wolfgang Appel

Ultra-thin chip technology and applications, a new paradigm in silicon technology

Joachim N. Burghartz, Wolfgang Appel, Christine Harendt et al. · Solid-State Electronics · 2010 · 84 citations

Engineering, Computer Engineering, Electrical Engineering +14

A New Fabrication and Assembly Process for Ultrathin Chips

Joachim N. Burghartz, Wolfgang Appel, Horst Rempp et al. · IEEE Transactions on Electron Devices · 2009 · 76 citations

Engineering, Manufacturing Engineering, Materials Science +16

Ultra-thin chips and related applications, a new paradigm in silicon technology

Joachim N. Burghartz, Wolfgang Appel, Christine Harendt et al. · 2009 · 35 citations

Engineering, Electrical Engineering, Materials Science +13

A Seamless Ultra-Thin Chip Fabrication and Assembly Process

Martin Zimmermann, Joachim N. Burghartz, Wolfgang Appel et al. · 2006 · 34 citations

Engineering, Manufacturing Engineering, Materials Science +16

Silicon on insulator material by Wafer Bonding

Christine Harendt, Charles E. Hunt, Wolfgang Appel et al. · Journal of Electronic Materials · 1991 · 33 citations

Engineering, Materials Engineering, Materials Science +14