Horst Rempp

Ultra-thin chip technology and applications, a new paradigm in silicon technology

Joachim N. Burghartz, Wolfgang Appel, Christine Harendt et al. · Solid-State Electronics · 2010 · 81 citations

Electrical Engineering, Wafer Scale Processing, Engineering +13

A New Fabrication and Assembly Process for Ultrathin Chips

Joachim N. Burghartz, Wolfgang Appel, Horst Rempp et al. · IEEE Transactions on Electron Devices · 2009 · 76 citations

Engineering, Buried Cavities, Integrated Circuits +18

Ultra-Thin Chips on Foil for Flexible Electronics

Horst Rempp, Joachim N. Burghartz, Christine Harendt et al. · 2008 · 40 citations

Engineering, Thin Film Process Technology, Ultra-thin Cmos Chips +16

Ultra-thin chips and related applications, a new paradigm in silicon technology

Joachim N. Burghartz, Wolfgang Appel, Christine Harendt et al. · 2009 · 35 citations

Engineering, New Applications, Silicon On Insulator +18

Compact modeling of CMOS transistors under variable uniaxial stress

Nicoleta Wacker, H. Richter, Mahadi-Ul Hassan et al. · Solid-State Electronics · 2011 · 27 citations

Device Modeling, Electrical Engineering, Engineering +5