Mahadi-Ul Hassan

Stress analysis of ultra-thin silicon chip-on-foil electronic assembly under bending

Nicoleta Wacker, H. Richter, Tù Hoang et al. · Semiconductor Science and Technology · 2014 · 35 citations

Compact modeling of CMOS transistors under variable uniaxial stress

Nicoleta Wacker, H. Richter, Mahadi-Ul Hassan et al. · Solid-State Electronics · 2011 · 27 citations

Device Modeling, Electrical Engineering, Engineering +5

Assembly and embedding of ultra-thin chips in polymers

Mahadi-Ul Hassan, C. Schomburg, Christine Harendt et al. · 2013 · 23 citations

Engineering, Nanostructured Polymer, Ultra-thin Chips +22

Technology and design aspects of ultra-thin silicon chips for bendable electronics

H. Richter, Horst Rempp, Mahadi-Ul Hassan et al. · 2009 · 19 citations

Engineering, Design Aspects, Integrated Circuits +23

Combining organic and printed electronics in Hybrid System in Foil (HySiF) based smart skin for robotic applications

Mahadi-Ul Hassan, Jürgen Keck, Hagen Klauk et al. · European Microelectronics and Packaging Conference · 2015 · 18 citations

Smart Textile, Engineering, Electronic Skin +20