Christine Harendt

Ultra-thin chip technology and applications, a new paradigm in silicon technology

Joachim N. Burghartz, Wolfgang Appel, Christine Harendt et al. · Solid-State Electronics · 2010 · 84 citations

Engineering, Computer Engineering, Electrical Engineering +14

Silicon fusion bonding and its characterization

Christine Harendt, Heinz‐Gerd Graf, B. Höfflinger et al. · Journal of Micromechanics and Microengineering · 1992 · 67 citations

Engineering, Materials Engineering, Materials Science +14

Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips

Christine Harendt, Jan Kostelnik, Andreas Kugler et al. · Solid-State Electronics · 2015 · 38 citations

Engineering, Electrical Engineering, Manufacturing Engineering +15

Ultra-thin chips and related applications, a new paradigm in silicon technology

Joachim N. Burghartz, Wolfgang Appel, Christine Harendt et al. · 2009 · 35 citations

Engineering, Electrical Engineering, Materials Science +13

Silicon on insulator material by Wafer Bonding

Christine Harendt, Charles E. Hunt, Wolfgang Appel et al. · Journal of Electronic Materials · 1991 · 33 citations

Engineering, Materials Engineering, Materials Science +14