Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips - Concepedia

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Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips

38

Citations

14

References

2015

Year

Christine Harendt, Jan Kostelnik, Andreas Kugler, Enno Lorenz, Stefan Saller, Alina Schreivogel, Zili Yu, Joachim N. Burghartz

Solid-State Electronics

Chip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Flexible ElectronicsMicrofabricationChip On BoardHybrid SystemsElectronic PackagingMicroelectronics

References

	Year	Citations

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