Jan Kostelnik

Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips

Christine Harendt, Jan Kostelnik, Andreas Kugler et al. · Solid-State Electronics · 2015 · 38 citations

Engineering, Electrical Engineering, Manufacturing Engineering +15

Waveguide and packaging technology for optical backplanes and hybrid electrical-optical circuit boards

H. Schröder, J. Bauer, F. Ebling et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2006 · 25 citations

Engineering, Computer Engineering, Electrical Engineering +17

Thin glass based electrical-optical circuit boards (EOCB) using ion-exchange technology for graded-index multimode waveguides

H. Schröder, Norbert Arndt-Staufenbiel, Axel Beier et al. · 2008 · 18 citations

Natural Sciences, Electrical Engineering, Materials Science +17

Combining organic and printed electronics in Hybrid System in Foil (HySiF) based smart skin for robotic applications

Mahadi-Ul Hassan, Jürgen Keck, Hagen Klauk et al. · European Microelectronics and Packaging Conference · 2015 · 18 citations

Engineering, Materials Science, Robotics Engineering +17

New generation interconnection technology: printed circuit boards with integrated optical layers

P. Demmer, Roland Mödinger, J. Bauer et al. · 2005 · 14 citations

Engineering, Electrical Engineering, Materials Science +17