F. Ebling

Statistics

Publications

Citations

178

H-Index

Active since

2000

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

E-T-A Elektrotechnische Apparate (Germany)

Siemens (Germany)

Würth Elektronik (Germany)

University of Siegen

F. Ebling is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, optical packaging, and electrical engineering.

Publications per year

2000–2009

Publications

New technology for electrical/optical systems on module and board level: the EOCB approach

D. Krabe, F. Ebling, Norbert Arndt-Staufenbiel et al. · 2000 · 58 citations

Engineering, Computer Engineering, Electrical Engineering +17

Waveguide and packaging technology for optical backplanes and hybrid electrical-optical circuit boards

H. Schröder, J. Bauer, F. Ebling et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2006 · 25 citations

Engineering, Computer Engineering, Electrical Engineering +17

Biocompatible hybrid flip chip microsystem integration for next generation wireless neural interfaces

Michael J. Topper, Matthias Klein, K. Buschick et al. · 2006 · 24 citations

Engineering, Bioengineering, Biomedical Engineering +17

Biochip readout system for point-of-care applications

Albrecht Brandenburg, Franziska Curdt, Gerd Sulz et al. · Sensors and Actuators B Chemical · 2009 · 20 citations

Engineering, Bioengineering, Biomedical Engineering +14

Polymer optical interconnects for PCB

H. Schröder, J. Bauer, F. Ebling et al. · 2001 · 19 citations

Engineering, Electrical Engineering, Materials Science +17

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