Evangelos A. Angelopoulos

Stress analysis of ultra-thin silicon chip-on-foil electronic assembly under bending

Nicoleta Wacker, H. Richter, Tù Hoang et al. · Semiconductor Science and Technology · 2014 · 35 citations

Ultra-thin chip technology for system-in-foil applications

Evangelos A. Angelopoulos, Martin Zimmermann, Wolfgang Appel et al. · 2010 · 27 citations

Mechanical characterisation of ultra-thin chips

Stefan Endler, Evangelos A. Angelopoulos, Horst Rempp et al. · 2011 · 13 citations

Engineering, Mechanical Engineering, Integrated Circuits +19

Packaging challenges associated with warpage of ultra-thin chips

Mahadi-Ul Hassan, Evangelos A. Angelopoulos, Horst Rempp et al. · 2010 · 10 citations

Engineering, Integrated Circuits, Chip Type +16

Manufacturing aspects of an ultra-thin chip technology

Evangelos A. Angelopoulos, Muhammad Alshahed, Wolfgang Appel et al. · 2012 · 10 citations