Saleh Ferwana

Ultra-thin chip technology for system-in-foil applications

Evangelos A. Angelopoulos, Martin Zimmermann, Wolfgang Appel et al. · 2010 · 27 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

Hybrid Systems-in-Foil—Combining the Merits of Thin Chips and of Large-Area Electronics

Joachim N. Burghartz, Zili Yu, Golzar Alavi et al. · IEEE Journal of the Electron Devices Society · 2019 · 25 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

All-silica fiber with low or medium OH-content for broadband applications in astronomy

Saleh Ferwana, Hanns-Simon Eckhardt, T. Simon et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2004 · 17 citations

Natural Sciences, Materials Engineering, Materials Science +17

Two-Dimensional Flex Sensor Exploiting Stacked Ultrathin Chips

Stefan Endler, Saleh Ferwana, Horst Rempp et al. · IEEE Electron Device Letters · 2012 · 17 citations

Engineering, Materials Engineering, Materials Science +17

Multi-Chip Patch in Low Stress Polymer Foils based on an Adaptive Layout for Flexible Sensor Systems

Björn Albrecht, Golzar Alavi, Mourad Elsobky et al. · 2018 7th Electronic System-Integration Technology Conference (ESTC) · 2018 · 17 citations

Engineering, Computer Engineering, Embedded Systems +9