Concepedia

Mourad Elsobky

ME

6

Publications

143

Citations

6

H-Index

2017

Active since

Affiliations

Institut für Mikroelektronik Stuttgart(Current)

Max Planck Institute for Solid State Research

University of Stuttgart

Mourad Elsobky is an author at Institut für Mikroelektronik Stuttgart specializing in electrical engineering, electronic packaging, and engineering.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringMicrofabricationFlexible ElectronicsFlexible SensorsMicroelectronicsMaterial ScienceMechanical EngineeringSensors

Publications per year

2017–2019

6

Publications

6

A digital library for a flexible low-voltage organic thin-film transistor technology

Mourad Elsobky, Mohamed Elattar, Golzar Alavi et al. · Organic Electronics · 2017 · 46 citations

Electrical Engineering, Engineering, Semiconducting Polymer +11

Ultra‐thin smart electronic skin based on hybrid system‐in‐foil concept combining three flexible electronics technologies

Mourad Elsobky, Yigit Mahsereci, Zili Yu et al. · Electronics Letters · 2018 · 32 citations

Smart Textile, Engineering, Electronic Skin +26

Hybrid Systems-in-Foil—Combining the Merits of Thin Chips and of Large-Area Electronics

Joachim N. Burghartz, Zili Yu, Golzar Alavi et al. · IEEE Journal of the Electron Devices Society · 2019 · 25 citations · Full text

Engineering, Mechanical Engineering, Thin Chips +19

Multi-Chip Patch in Low Stress Polymer Foils based on an Adaptive Layout for Flexible Sensor Systems

Björn Albrecht, Golzar Alavi, Mourad Elsobky et al. · 2018 7th Electronic System-Integration Technology Conference (ESTC) · 2018 · 17 citations

Engineering, Device Integration, Mechanical Engineering +23

Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications

Amro Eldebiky, Mourad Elsobky, H. Richter et al. · Advances in radio science · 2018 · 12 citations · Full text

Smart Sensor, Food Packaging, Engineering +25

Rows per page

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