Olaf Wittler

Statistics

Publications

Citations

523

H-Index

Active since

1999

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Fraunhofer Institute for Electronic Nano Systems

Infineon Technologies (Germany)

Chemnitz University of Technology

Olaf Wittler is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, mechanical engineering, and electronic packaging.

ORCID

Top concepts

EngineeringMechanical EngineeringElectronic PackagingMaterial ScienceMicroelectronicsMechanics Of MaterialsMicrofabricationApplied PhysicsThermal EngineeringHeat Transfer

Publications per year

1999–2022

Publications

Thermo-Mechanical Reliability of 3D-integrated Microstructures in Stacked Silicon

Bernhard Wunderle, Olaf Wittler, Eberhard Kaulfersch et al. · MRS Proceedings · 2006 · 63 citations

3D Ic Architecture, Stacked Silicon, Engineering +8

Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation

Bernhard Wunderle, Karl‐Friedrich Becker, R. Sinning et al. · Microsystem Technologies · 2009 · 45 citations

Thermo-mechanical Reliability, Reliability Engineering, Engineering +12

Evaluation of Packaging Effect on MEMS Performance: Simulation and Experimental Study

Maryna Lishchynska, Conor O’Mahony, O. Slattery et al. · IEEE Transactions on Advanced Packaging · 2007 · 38 citations

Engineering, Micromechanics, Mechanical Engineering +18

Microstructural evolution of ultrasonic-bonded aluminum wires

M. Broll, Jan Höfer, S. A. Schmitz et al. · Microelectronics Reliability · 2015 · 37 citations

Materials Science, Ultrasonic-bonded Aluminum Wires, Engineering +4

Combination of Experimental and Simulation Methods for Analysis of Sintered Ag Joints for High Temperature Applications

Constanze Weber, H. Walter, Marius van Dijk et al. · 2016 · 35 citations

Friction Welding, Engineering, Sintered Ag Joints +18

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