Eberhard Kaulfersch - Concepedia

Author

Eberhard Kaulfersch

Fraunhofer Institute for Reliability and Microintegration

Also Known As

E. Kaulfersch, Eberhard Kaulfersch

Publications

268

Citations

H-Index

Concepts

All Affiliations

Fraunhofer Institute for Reliability and Microintegration Technische Universität Berlin Jenoptik (Germany)Angewandte Micro Messtechnik (Germany)Max-Born-Institute for Nonlinear Optics and Short Pulse Spectroscopy

About

Eberhard Kaulfersch is an author at Fraunhofer Institute for Reliability and Microintegration specializing in electronic packaging, engineering, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	7	7	188
2	Applied Physics	5	5	164
3	Electrical Engineering	5	5	112
4	Computer Engineering	1	1	11
5	Materials Engineering	1	1	14

Eberhard Kaulfersch

Publications

188

Citations

H-Index

Page 1

	Year	Citations
Thermo-Mechanical Reliability of 3D-integrated Microstructures in Stacked Silicon Bernhard Wunderle, Olaf Wittler, Eberhard Kaulfersch, MRS Proceedings 3D Ic ArchitectureStacked SiliconEngineeringAdvanced Packaging (Semiconductors)Microfabrication	2006	63
Micro thermal management of high-power diode laser bars Dirk Lorenzen, J. Bonhaus, W.R. Fahrner, IEEE Transactions on Industrial Electronics EngineeringMicrochannel CoolerLiquid Metal CoolingLaser MaterialWater Flux	2001	34
Quantitative strain analysis in AlGaAs-based devices Jens W. Tomm, A. Gerhardt, Roland Müller, Applied Physics Letters Wide-bandgap SemiconductorEngineeringMechanical EngineeringOptoelectronic DevicesStressstrain Analysis	2003	28
Spectroscopic measurement of packaging-induced strains in quantum-well laser diodes Jens W. Tomm, Roland Müller, A. Bärwolff, Journal of Applied Physics PhotonicsElectrical EngineeringStrain PortionEngineeringPhysics	1999	25
Design, simulation and technological realization of a reliable packaging concept for high power laser bars Eberhard Kaulfersch, M. Töpfer, R. Aschenbrenner, Technological RealizationEngineeringMechanical EngineeringLaser MaterialHigh-power Lasers	1998	14
Dynamic mechanical behavior of SnAgCu BGA solder joints determined by fast shear tests and FEM simulations Eberhard Kaulfersch, Sven Rzepka, V. Ganeshan, EngineeringMechanical EngineeringDynamic Mechanical BehaviorBga Solder BallsMechanics Modeling	2007	13
Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging Bernhard Wunderle, J. Auersperg, Eberhard Kaulfersch, Hardware ModelingEngineeringMechanical EngineeringElectronic DesignModeling Tool	2003	11

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