Thermo-Mechanical Reliability of 3D-integrated Microstructures in Stacked Silicon - Concepedia

Concepedia

Publication | Closed Access

Thermo-Mechanical Reliability of 3D-integrated Microstructures in Stacked Silicon

63

Citations

10

References

2006

Year

Bernhard Wunderle, Olaf Wittler, Eberhard Kaulfersch, Peter Ramm, B. Michel, H. Reichl

MRS Proceedings

3D Ic ArchitectureStacked SiliconEngineeringAdvanced Packaging (Semiconductors)MicrofabricationMechanical EngineeringApplied PhysicsElectronic PackagingSilicon On Insulator3D PrintingMicrostructure

References

	Year	Citations

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