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Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation

Thermo-mechanical ReliabilityReliability EngineeringEngineeringChip-scale PackageAdvanced Packaging (Semiconductors)Technology DevelopmentHardware ReliabilityChip On BoardMechanical EngineeringChip AttachmentHeat TransferElectronic PackagingMicroelectronicsThermal EngineeringPower Chip-on-board Assemblies