1
Publications
24
Citations
1
H-Index
2010
Active since
Affiliations
Frank Rehme is an author at Fraunhofer Institute for Reliability and Microintegration specializing in electronic packaging, 3d printing, and microfabrication.
Top concepts
3D PrintingEngineeringMaterial ScienceMicrofabricationElectronic PackagingMechanical Engineering
Publications per year
2010–2010
1
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