Concepedia

Gordon Elger

GE

45

Publications

1.5K

Citations

21

H-Index

1983

Active since

Affiliations

Technische Hochschule Ingolstadt(Current)

University of Padua

Philips (Germany)

Freie Universität Berlin

Fraunhofer Institute for Transportation and Infrastructure Systems

Gordon Elger is an author at Technische Hochschule Ingolstadt specializing in engineering, electronic packaging, and electrical engineering.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringMaterial ScienceHeat TransferThermal EngineeringMechanical EngineeringChemistryApplied PhysicsMicroelectronics

Publications per year

1983–2023

45

Publications

45

Predictive maintenance enabled by machine learning: Use cases and challenges in the automotive industry

Andreas Theissler, Judith Pérez-Velázquez, Marcel Kettelgerdes et al. · Reliability Engineering & System Safety · 2021 · 449 citations · Full text

Development of an assembly process and reliability investigations for flip-chip LEDs using the AuSn soldering

Gordon Elger, Matthias Hütter, Hermann Oppermann et al. · Microsystem Technologies · 2002 · 64 citations

Materials Science, Engineering, Advanced Packaging (Semiconductors) +8

Multi-Sensor Data Fusion for Real-Time Multi-Object Tracking

Numan Senel, Klaus Kefferpütz, Kristina Doycheva et al. · Processes · 2023 · 55 citations · Full text

Engineering, Sensor Data Fusion, Field Robotics +19

Transient thermal analysis as measurement method for IC package structural integrity

Alexander Hanß, Maximilian Schmid, E Liu et al. · Chinese Physics B · 2015 · 49 citations

Engineering, Mechanical Engineering, Structural Mechanics +21

Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations

Gordon Elger, Shri Vishnu Kandaswamy, E. Liu et al. · Microelectronics Journal · 2015 · 46 citations

Rows per page

1–5 of 45