Hiren R. Kotadia

A review: On the development of low melting temperature Pb-free solders

Hiren R. Kotadia, Philip D. Howes, S.H. Mannan · Microelectronics Reliability · 2014 · 457 citations

Materials Engineering, Materials Science, Engineering +3

Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates

Hiren R. Kotadia, Omid Mokhtari, M.P. Clode et al. · Journal of Alloys and Compounds · 2011 · 118 citations

Materials Science, Materials Engineering, Material Analysis +9

Effect of high-intensity ultrasonic irradiation on the modification of solidification microstructure in a Si-rich hypoeutectic Al–Si alloy

A. Das, Hiren R. Kotadia · Materials Chemistry and Physics · 2010 · 96 citations

Materials Science, Engineering, Mechanical Engineering +6

Effect of Ni alloying on the microstructural evolution and mechanical properties of two duplex light-weight steels during different annealing temperatures: Experiment and phase-field simulation

Alireza Rahnama, Hiren R. Kotadia, Seetharaman Sridhar · Acta Materialia · 2017 · 83 citations · Full text

Materials Science, Engineering, Superalloy +10

On the microstructural refinement in commercial purity Al and Al-10 wt% Cu alloy under ultrasonication during solidification

Hiren R. Kotadia, Ma Qian, Dmitry Eskin et al. · Materials & Design · 2017 · 83 citations · Full text

Materials Science, Materials Engineering, Engineering +11