M.P. Clode

Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects

Jianfeng Li, S.H. Mannan, M.P. Clode et al. · Acta Materialia · 2006 · 227 citations

Natural Sciences, Materials Engineering, Materials Science +16

Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates

Hiren R. Kotadia, Omid Mokhtari, M.P. Clode et al. · Journal of Alloys and Compounds · 2011 · 120 citations

Natural Sciences, Materials Engineering, Materials Science +12

Constitutive equations for modelling flow softening due to dynamic recovery and heat generation during plastic deformation

Min Zhou, M.P. Clode · Mechanics of Materials · 1998 · 102 citations

Natural Sciences, Materials Engineering, Physics +17

On computer simulation methods to model Zener pinning

Azmir Harun, Elizabeth A. Holm, M.P. Clode et al. · Acta Materialia · 2006 · 75 citations

Business, Physics, Computational Physics +8

Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders

Jianfeng Li, S.H. Mannan, M.P. Clode et al. · Acta Materialia · 2006 · 58 citations

Natural Sciences, Materials Engineering, Materials Science +16